WO2006010108A3 - Methods and apparatus for low distortion parameter measurements - Google Patents

Methods and apparatus for low distortion parameter measurements Download PDF

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Publication number
WO2006010108A3
WO2006010108A3 PCT/US2005/024505 US2005024505W WO2006010108A3 WO 2006010108 A3 WO2006010108 A3 WO 2006010108A3 US 2005024505 W US2005024505 W US 2005024505W WO 2006010108 A3 WO2006010108 A3 WO 2006010108A3
Authority
WO
WIPO (PCT)
Prior art keywords
methods
data
low distortion
measuring
distortion parameter
Prior art date
Application number
PCT/US2005/024505
Other languages
French (fr)
Other versions
WO2006010108B1 (en
WO2006010108A2 (en
Inventor
Dean Hunt
Kameshwar Poolla
Costas J Spanos
Michael Welch
Mason L Freed
Original Assignee
Onwafer Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Onwafer Technologies Inc filed Critical Onwafer Technologies Inc
Priority to JP2007520584A priority Critical patent/JP5137573B2/en
Priority to KR1020077001465A priority patent/KR101237782B1/en
Publication of WO2006010108A2 publication Critical patent/WO2006010108A2/en
Publication of WO2006010108A3 publication Critical patent/WO2006010108A3/en
Publication of WO2006010108B1 publication Critical patent/WO2006010108B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
    • G01K1/18—Special arrangements for conducting heat from the object to the sensitive element for reducing thermal inertia
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means

Abstract

This invention seeks to provide methods and apparatus that can improve the accuracy of measured parameter data used for processing workpieces. One aspect of the present invention includes methods of measuring process conditions with low distortion of the measurements caused by the measuring apparatus. The measurements include data for applications such as data for monitoring, controlling, and optimizing processes and process tools. Another aspect of the present invention includes apparatus for measuring substantially correct data for applications such as generating data for monitoring, controlling, and optimizing processes and process tools.
PCT/US2005/024505 2004-07-10 2005-07-08 Methods and apparatus for low distortion parameter measurements WO2006010108A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007520584A JP5137573B2 (en) 2004-07-10 2005-07-08 Method and apparatus for reducing distortion in parameter measurement
KR1020077001465A KR101237782B1 (en) 2004-07-10 2005-07-08 Methods and apparatus for low distortion parameter measurements

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US58689104P 2004-07-10 2004-07-10
US60/586,891 2004-07-10

Publications (3)

Publication Number Publication Date
WO2006010108A2 WO2006010108A2 (en) 2006-01-26
WO2006010108A3 true WO2006010108A3 (en) 2007-03-22
WO2006010108B1 WO2006010108B1 (en) 2007-05-31

Family

ID=35785782

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/024505 WO2006010108A2 (en) 2004-07-10 2005-07-08 Methods and apparatus for low distortion parameter measurements

Country Status (5)

Country Link
US (1) US7299148B2 (en)
JP (2) JP5137573B2 (en)
KR (1) KR101237782B1 (en)
TW (1) TWI279530B (en)
WO (1) WO2006010108A2 (en)

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US7545272B2 (en) 2005-02-08 2009-06-09 Therasense, Inc. RF tag on test strips, test strip vials and boxes
US7802917B2 (en) * 2005-08-05 2010-09-28 Lam Research Corporation Method and apparatus for chuck thermal calibration
GB0523667D0 (en) * 2005-11-21 2005-12-28 In2Tec Ltd Displacement sensor
US7498802B2 (en) 2006-07-10 2009-03-03 3M Innovative Properties Company Flexible inductive sensor
US7948380B2 (en) 2006-09-06 2011-05-24 3M Innovative Properties Company Spatially distributed remote sensor
US7969323B2 (en) * 2006-09-14 2011-06-28 Siemens Energy, Inc. Instrumented component for combustion turbine engine
US7924408B2 (en) * 2007-02-23 2011-04-12 Kla-Tencor Technologies Corporation Temperature effects on overlay accuracy
US8152367B2 (en) * 2007-05-04 2012-04-10 Sealed Air Corporation (Us) Insulated container having a temperature monitoring device
JP4735670B2 (en) * 2008-06-11 2011-07-27 富士ゼロックス株式会社 Printed circuit board and image processing apparatus
US7929294B2 (en) * 2008-09-11 2011-04-19 Commscope Inc. Of North Carolina Hybrid cooling system for outdoor electronics enclosure
JP5704129B2 (en) * 2012-06-22 2015-04-22 東京エレクトロン株式会社 Data acquisition method for substrate processing apparatus and sensor substrate
US9514970B2 (en) * 2013-01-24 2016-12-06 Kla-Tencor Corporation Methods of attaching a module on wafer substrate
KR102059716B1 (en) 2013-05-30 2019-12-26 케이엘에이 코포레이션 Method and system for measuring heat flux
US9943232B2 (en) 2014-02-03 2018-04-17 Welch Allyn, Inc. Thermometry heating and sensing assembly
CN104880685A (en) * 2015-06-15 2015-09-02 国网上海市电力公司 Method for evaluating operation of secondary loop of metering device
US10216100B2 (en) 2015-07-16 2019-02-26 Asml Netherlands B.V. Inspection substrate and an inspection method
WO2017014380A1 (en) * 2015-07-20 2017-01-26 엘지이노텍 주식회사 Non-powered body temperature sensing device and communication device included therein
US10460966B2 (en) * 2016-06-15 2019-10-29 Kla-Tencor Corporation Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications
KR101897541B1 (en) * 2016-10-05 2018-09-13 (주)코텍 Slim bezel of curved display device, apparatus and method for producing slim bezel of curved display device
KR102078774B1 (en) * 2017-07-10 2020-02-18 주식회사 유뱃 Power supply device
CN108120918A (en) * 2017-08-07 2018-06-05 鸿秦（北京）科技有限公司 A kind of chip makes physical destroys online test method and device on effect circuit board
DE202018104014U1 (en) * 2018-07-12 2018-10-17 Wema System As Temperature sensor unit and urea sensor
JP7258727B2 (en) * 2019-11-18 2023-04-17 株式会社Ｓｃｒｅｅｎホールディングス Temperature measurement device, temperature measurement system, and temperature measurement method using temperature measurement device
JP7414664B2 (en) * 2020-08-12 2024-01-16 東京エレクトロン株式会社 Temperature measurement unit, heat treatment equipment and temperature measurement method

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Patent Citations (1)

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Also Published As

Publication number Publication date
US7299148B2 (en) 2007-11-20
TW200617363A (en) 2006-06-01
JP5705187B2 (en) 2015-04-22
KR20070051255A (en) 2007-05-17
JP5137573B2 (en) 2013-02-06
WO2006010108B1 (en) 2007-05-31
TWI279530B (en) 2007-04-21
US20060052969A1 (en) 2006-03-09
WO2006010108A2 (en) 2006-01-26
JP2013058760A (en) 2013-03-28
KR101237782B1 (en) 2013-02-28
JP2008506267A (en) 2008-02-28

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