US20070295494A1

US20070295494A1 - Flat Type Heat Transferring Device and Manufacturing Method of the Same

Info

Publication number: US20070295494A1
Application number: US11/768,689
Authority: US
Inventors: George Mayer; Jae Choi; Ki Nam
Original assignee: Celsia Technologies Korea Inc
Current assignee: CELSIA TECHNOLOGIES Inc
Priority date: 2006-06-26
Filing date: 2007-06-26
Publication date: 2007-12-27
Also published as: KR100795753B1; KR20080000162A

Abstract

The present invention relates to a flat type heat transferring device, and manufacturing method of the same, which is comprises of a capillary wick that is provided inside a case and formed by weaving a wire in the horizontal direction and the vertical direction so as to absorb a liquid coolant, and a linear member that is formed to have a different wire diameter from the wire of the capillary wick and woven in the capillary wick to form a space where a vapor coolant flows. Accordingly, the mechanically stabilized support rigidity can be secured and an ultra thin configuration can be implemented with a light-weight, in particular, the problem of degrading the capillary force is resolved, and it has the effect that the cooling efficiency can be improved with smooth flowing of a coolant.

Description

FIELD OF THE INVENTION

The present invention relates to a flat type heat transferring device which can be applied to an electronic device including CPU, IC chip, and a printed circuit board, in particular, to a flat heat transferring device and manufacturing method thereof, which can improve the cooling performance with a simple structure by using a unistructure of the mesh type combining a linear member with a capillary wick.

BACKGROUND OF THE INVENTION

The flat type heat transferring device, generally called as heat pipe, is a cooling device which delivers the heat from the place having a high heating density to the place having a low heating density by using a latent heat which is necessary for the process of the state transition of the fluid.
As electronic products including a notebook PC, PDA, a cellular phone, and a flat panel display device become slim and ultra lighting, the development of the heat transferring device has been continued, which has an excellent cooling performance while it is thin and light.
FIG. 1 is a perspective view in which the heat pipe is disclosed in the Japanese patent publication No. 2004-22603, which is one of a flat type heat transferring device. Referring to it, the flat type heat transferring device structure of the related art will be described.
The flat type heat transferring device is comprised of a container 1 made by welding a peripheral unit 4 of polymerized sheets 2, 3 of the thin shape, a mesh 5 which generates a capillary force with being accepted within the container 1 on working state, and an operation fluid sealed within the container 1.
Particularly, the mesh 5 is formed in such a manner that a column 6 and a row 7 have different diameters, while it is exemplified that the diameter of the column 6 is larger in the drawing.
As to the flat type heat transferring device in which such kind of mesh 5 is equipped, in the mesh 5, the column 6 having a relatively larger diameter supports the gap of the container 1 to form a space such that the passage in which a vapor coolant flows is formed.
However, as to the flat type heat transferring device as described above, the diameter of one of the column 6 and the row 7, that is, the wire diameter is configured to be large such that the gap between the column 6 and the row 7 does not dense. Therefore, there is a problem in that the capillary force is degraded and the flow of the liquid coolant is not smooth.
Further, due to such a problem, in case the gap between the column 6 and the row 7 is tightly formed so as to increase the capillary force, the line 6 which has a relatively large wire diameter occupies a considerable volume inside of the container 1 to stick to the upper and lower side of the container 1. Therefore, the flow of the vapor coolant is obstructed by the tightly arranged column 6. Accordingly, the problem that the flow of the vapor coolant is not smooth is generated.
In this way, there is a problem in that the cooling efficiency of the conventional flat type heat transferring device is, on the whole, degraded as the flow of the vapor coolant and the liquid coolant is not smooth.
Further, as to the conventional flat type heat transferring device, it is manufactured while the wire diameter of the column 6 and the row 7 is different. Therefore, there is a problem that the manufacturing method is exceedingly restrictive, and it is difficult to apply to the porosity capillary wick that is not weaved body structure.

SUMMARY OF THE INVENTION

Accordingly, an object of the present invention is to solve at least the problems and disadvantages of the background art.
An object of the present invention is to provide to a flat heat transferring device and manufacturing method thereof, which can reduce the manufacturing cost with a simple general structure and assembling structure by combining the linear member with the capillary wick to form an unistructure.
Another object of the present invention is to provide to a flat heat transferring device and manufacturing method thereof, which can secure a support stiffness which is mechanically stabilized inside of the flat heat transferring device, while it can strengthen the durability with increasing the flexibility of the flat type heat transferring device.
A further object of the present invention is to provide a flat heat transferring device and manufacturing method thereof, which can form one uniweave structure to move a liquid coolant and a vapor coolant at the same time by weaving a linear member forming a space in which the vapor coolant passes in the capillary wick, thereby, the thickness, as a whole, becomes thin and, simultaneously, a ultra thin configuration can be used with a light weight.
A still further object of the present invention is to provide a flat heat transferring device and manufacturing method thereof, which can resolve the problem that the capillary force is, on the whole, degraded, thereby, the cooling efficiency can be improved.
A still further object of the present invention is to provide a flat heat transferring device and manufacturing method thereof, which can adequately secures the channel of the vapor coolant as well as the liquid coolant, thereby, the cooling efficiency can be more improved.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described in detail with reference to the following drawings in which like numerals refer to like elements. The accompany drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. In the drawings:
FIG. 1 is a perspective view illustrating a flat type heat transferring device of related art.
FIG. 2 is a disassembled perspective view illustrating a flat type heat transferring device of an embodiment according to the present invention.
FIG. 3 is a perspective view of an embodiment according to the present invention illustrating the state where a linear member is installed in the capillary wick.
FIG. 4 is a cross-sectional view of A-A line direction of FIG. 3.
FIG. 5 is a cross-sectional view illustrating the state where the capillary wick and the linear member of the embodiment are installed inside the case.
FIG. 6 is a flow chart for illustrating an embodiment of the method for combining a capillary wick and with a linear member according to the present invention.
FIG. 7 is a flow chart for illustrating another embodiment of the method for combining a capillary wick and with a linear member according to the present invention.
FIGS. 8 to 10 are plane views illustrating various embodiments of the method of inserting a linear member into the capillary wick.
FIG. 11 is a perspective view of other embodiment illustrating the state where a linear member is installed in the capillary wick according to the present invention.
FIG. 12 is a cross-sectional view of B-B line direction of FIG. 11.
FIG. 13 and FIG. 14 are drawings illustrating the configuration of other embodiment of a linear member according to the present invention.
FIG. 15 is a drawing illustrating the configuration where an unistructure is arranged with a multiplex construction in a flat type tube structure according to the present invention.
FIG. 16 is a drawing illustrating the state where a linear member is installed in a capillary wick of a multiplex construction in a flat type tube structure according to the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Embodiments of the present invention will be described in a more detailed manner with reference to the drawings.
A flat type heat transferring device according to an aspect of the present invention comprises a case of flat structure forming a sealed internal space; a coolant injected inside the case; and an uniweave structure including a capillary wick that is provided inside the case and formed by weaving a wire in the horizontal direction and the vertical direction so as to absorb a liquid coolant, and a linear member that is formed to have a different wire diameter from the wire of the capillary wick and woven in the capillary wick to form a space where a vapor coolant flows.
The case is comprised of a first plate and a second plate forming a sealed internal space, while they form an upper surface and a lower surface respectively.
The case is comprised of a flat type tube forming the outer cell.
The wire diameter of the linear member is formed to be larger than the diameter of the wire forming the capillary wick.
In accordance with an aspect of the present invention, a plurality of the linear members are woven in the capillary wick.
The plurality of the linear members are arranged in parallel with the capillary wick.
The exposed locations of the plurality of linear members woven in the capillary wick are positioned to be opposed to the exposed locations of the adjacent linear member.
The exposed locations of the plurality of linear members woven in the capillary wick are positioned to be identical with the exposed locations of the adjacent linear member.
The linear member is implemented in the capillary wick with a structure woven with a zigzag form.
The linear member is formed with one or more materials among metal, plastic combinations, glass, and graphite.
The linear member is formed with a porous material.
The linear member is formed with a bundle structure collecting a plurality of wires.
In accordance with an aspect of the present invention, an uniweave structure in which the linear member is combined with the capillary wick is arranged with a multiplet structure within the case.
The capillary wick is arranged with a multiplet structure; and the linear member is inserted into the gap between the capillary wicks to combine.
A flat type heat transferring device according to another aspect of the present invention comprises a case of flat structure forming a sealed internal space; a coolant injected inside the case; a capillary wick that is provided inside the case and absorbs a liquid coolant; and a linear member that is combined with the capillary wick and inserted into the capillary wick to form a space where a vapor coolant flows.
The capillary wick is made of a porosity sheet.
The capillary wick is made of a groove sheet having a plurality of grooves or holes.
A manufacturing method of the flat type heat transferring device according to further aspect of the present invention comprises an uniweave structure for an internal space of the case, which is manufactured by weaving the linear member together in the process of weaving the horizontal wire and the vertical wire.
A manufacturing method of the flat type heat transferring device according to still further aspect of the present invention comprises forming one or more cut-out parts so as to insert the linear member into the capillary wick in a constant distance; and manufacturing an uniweave structure for an internal space of the case by inserting the linear member into the capillary wick in which the cut-out part is formed.
The cut-out part is formed by using a press die.
A manufacturing method of the flat type heat transferring device according to still further aspect of the present invention comprises folding the capillary wick with a zigzag form to arrange; inserting the linear member into the arranged capillary wick; and unfolding the capillary wick to manufacture the uniweave structure for the internal space of the flat type heat transferring device.
In accordance with still further aspect of the present invention, when the linear member is inserted into the capillary wick, firstly an insertion pipe is inserted into the capillary wick; and the linear member is inserted into the insertion pipe.
Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the attached drawings.
FIG. 2 is a disassembled perspective view illustrating a flat type heat transferring device of an embodiment according to the present invention, FIG. 3 is a perspective view of an embodiment according to the present invention illustrating the state where a linear member is installed in the capillary wick, FIG. 4 is a cross-sectional view of A-A line direction of FIG. 3, and FIG. 5 is a cross-sectional view illustrating the state where the capillary wick and the linear member of the embodiment are installed inside the case.
As shown in FIG. 2 to FIG. 5 the flat type heat transferring device is comprised of a first plate 11, forming the upper side, and a second plate 12 forming the lower surface. The first plate 11 and the second plate 12 configure a case 10 that forms the outer shape of the flat type heat transferring device.
Here, the first plate 11 and the second plate 12 are comprised of a board material which has the rigidity that can sufficiently protect the inner structure, such as aluminum, titanium, plastic, metalized plastic, graphite or other metal material and plastic combinations, preferably, a copper board which is a metal having a high heat conductivity can be used.
The first plate 11 and the second plate 12 form a cover plate and a bottom plate, while the edge part of two plates 11, 12 is mutually welded such that a structure in which the inside is sealed up is formed in order that a coolant is not flowed out, thereby, the case 10 is formed. Additionally, one of the plates is adhered closely to the heating source including a PCB substrate or an IC chip for cooling down.
For example, in order to adhere readily the first plate 11 closely to PCB or the IC chip, it can be formed as a planar structure, while a bonding layer can be formed on the plane.
In the two plates 11, 12, that is, in the internal space of the case 10, a capillary wick 21 is provided so as to absorb the liquid coolant by a capillary phenomenon.
Here, it is preferable that the capillary wick 21 is formed with a plane sheet type structure, while it can be formed with a material of synthetic fiber having a porous structure or of a weaved body manufactured by weaving a wire.
Hereinafter, in the embodiment, the weaved body which is manufactured by weaving in the vertical and the horizontal direction will be exemplified and illustrated. In the drawings, for convenience, the wire in the vertical direction will be called as a vertical line 23 and the wire in the horizontal direction will be called as a horizontal line 22.
To such a capillary wick 21, a linear member 30 is combined with a woven method to form a mesh type uniweave structure 20. The linear member 30 is installed to support so as to secure the internal space between two plates 11, 12, to secure the path in which the vapor coolant evaporated in the capillary wick 21 moves.
The diameter of the linear member 30, that is, the wire diameter is formed to be larger than the wire diameter of the horizontal line 22 and the vertical line 23 which form the capillary wick 21, thereby, such a structure can be implemented.
As to the linear member 30, it is preferable that the wire structure of one or mixed among metal, plastic combinations, glass or graphite, however, it is not thus restricted and various structures and configurations can be implemented. The example of other configuration will be illustrated in FIG. 13 and FIG. 14.
One or more linear members 30 are installed in the capillary wick 21. Preferably, multiple linear members 30 are uniformly inserted in the capillary wick 21 with a constant gap.
The structure of combining the linear member 30 with the capillary wick 21 can be variously configured according to the implement condition, while the combination structure of the embodiment will be illustrated through FIG. 3 and FIG. 4.
As shown in FIG. 3, the capillary wick 21 is formed with the structure in which the horizontal line 22 and vertical line 23 are woven. a plurality of linear members 30 are combined with the capillary wick 21 in the same direction as the horizontal line (the same direction as the vertical line can also be available) in order to be located alternately in the upper and the lower portion of the capillary wick 21 by being inserted into the linear members 30.
At this time, as to the plurality of linear members 30, while each linear member 30 is parallelly arranged, it is preferable that the gap of the linear member 30 is uniformly arranged.
In this way, the capillary wick 21 and the linear member 30 form one mesh type uniweave structure 20.
FIG. 5 is a cross-sectional view showing a flat type heat transferring device installing the structure in which a plurality of linear members 30 are inserted into the capillary wick 21 of the weaved body inside of two plates 11, 12. The capillary wick 21 adheres closely to two plates 11, 12 by the linear member 30 in which the wire diameter is relatively largely formed according to the structure, at the same time, the space K between two plates 11, 12 in which the vapor coolant can move can be secured.
Therefore, as to the flat type heat transferring device, the liquid coolant evaporates into the vapor coolant due to the heat delivered from at least one side of two plates 11, 12 in the state where the liquid coolant is absorbed into the capillary wick 21 through the capillary phenomena. The vapor coolant which is evaporated like that delivers the heat with flowing through the internal space K formed by the linear member 30.
Particularly, according to the present invention, as the linear member 30 is combined with the capillary wick 21 woven in the horizontal and vertical direction, the space is secured by the linear member 30 in the state where the capillary force of the capillary wick 21 is sufficiently maintained. Therefore, it has an excellent cooling performance, and the capillary effect which is excellent than the structure having different wire diameters of the horizontal wire and the vertical wire of the capillary wick 21 like the related art.
Further, the capillary wick 21 and the linear member 30 form one mesh type uniweave structure 20. Therefore, it can be conveniently installed inside the case 10, while the mechanical rigidity can be sufficiently maintained.
Referring to FIG. 6 and FIG. 7, the combination method of the capillary wick 21 and the linear member 30 according to the present invention will be illustrated.
Firstly, FIG. 6 is a flow chart for illustrating an embodiment of the method for combining the capillary wick with the linear member.
According to the embodiment illustrated in FIG. 6, an unistructure 20 for the internal space of the flat type heat transferring device is manufactured after the scar from a knife, that is, a plurality of cut-outs C are formed on the place where the linear member 30 is to be inserted in the capillary wick 21, and then, each linear member 30 between the cut-outs C is inserted in the capillary wick 21 for combination.
Here, it is preferable that the capillary wick 21 is comprised of a weaved body. However, it is not thus restricted. If the various configuration is capable of generating the capillary force such as a porosity sheet, it can be selected.
As to the method for forming the cut-out C on the capillary wick 21, the mode in which a manufacturer directly forms the cut-out C on the capillary wick 21 with a tool including a knife can be used. However, more preferably, the mode in which the cut-out C is formed with a press processing method by using the mold which is manufactured in order to form the cut-out C with a fixed arrangement can be used.
FIG. 7 is a flow chart for illustrating another embodiment according to the present invention.
According to the embodiment illustrated in FIG. 7, after the capillary wick 21 is folded with the zigzag form, a plurality of linear members 30 are inserted into the capillary wick 21 which folded like that, then, the capillary wick 21 is unfolded to manufacture the unistructure 20 for the internal space of the flat type heat transferring device.
At this time, when the linear member 30 is inserted into the folded capillary wick 21, after an insertion pipe P is inserted into the place where the linear member 30 is inserted, the linear member 30 is inserted in this insertion pipe P. Thereafter, the insertion pipe P is pulled out, and the capillary wick 21 is unfolded in the state where only the linear member 30 is left.
Here, it is desirable that the insertion pipe P is used for the state in which multiple insertion pipes are fixed together in the pipe fixing panel F. The hole H can be formed in advance on the part in which the linear member 30 is inserted in the capillary wick 21, while the linear member 30 can be inserted into this hole.
A various method for inserting the linear member 30 in the capillary wick 21 will be described with reference to FIG. 8 to FIG. 10.
FIG. 8 is a plane view, which is identical with the embodiment of FIG. 4 and FIG. 5, exemplifies the structure in which the linear member 30 is inserted in the capillary wick 21. As to the unistructure 20A, the location of a plurality of linear members 30 is configured to be opposed to the location exposed in the capillary wick 21 of the other adjacent linear member 30.
In FIG. 8, while the first linear member 30A and the second linear member 30B are inserted in parallel with the capillary wick 21, in case the first linear member 30A ascends to the upper portion of the capillary wick 21, the second linear member 30B descends, on the contrary, to be inserted into the lower part of the capillary wick 21.
This structure has the characteristic that the securing of space between two plates 11, 12 is facilitated, and at the same time, the space becomes uniform.
As to the unistructure 20B illustrated in FIG. 9, differently with the example of FIG. 8, the exposed location of the linear member 30 is configured to be identical with the exposed location in the capillary wick 21 of the adjacent linear member 30.
As shown in FIG. 8 and FIG. 9, the unistructure 20C illustrated in FIG. 10 is a drawing showing the structure in which not a plurality of linear members 30 but one linear member 30 is inclined and inserted with a zigzag form for the horizontal direction of the capillary wick 21.
In FIG. 10, it exemplified that one linear member 30 is used. However, it can be configured that a plurality of linear members 30 can be inserted with a zigzag form, if necessary.
In the meantime, in the above case, the structure of inserting the linear member 30 into the capillary wick 21 was exemplified. Howcnm,uyt42/ever, according to the implementation condition, the linear member 30 can be woven together when the capillary wick 21 is woven.
The above-described flat type heat transferring device of the present invention exemplified the structure of the linear member 30 which is inserted into the capillary wick 21. However, referring to FIG. 11 and FIG. 12, another embodiment of the present invention illustrates the method for weaving together when the capillary wick 21 is woven.
FIG. 11 is a perspective view of another embodiment showing the state where the linear member 30 is installed in the capillary wick 21 in the present invention. FIG. 12 shows a cross-sectional view of B-B line direction of FIG. 11.
As shown in the drawings, the capillary wick 21 is formed by weaving the horizontal line 22 and the vertical line 23, while the wire of one side of the horizontal line 22 and the vertical line 23 is configured to be relatively large, that is, it is configured by adding or replacing a thick linear member 30 to weave.
In the drawing of this embodiment, the configuration in which the linear member 30 that has a wire diameter larger than other vertical line 23 was added in a constant gap among vertical lines 23 was exemplified. However, the same configuration can be used in the horizontal line 22.
Here, it may be acceptable that the linear member 30 can be made of the same material as the vertical lines 23 or the horizontal line 22 weaving the capillary wick 21 or can be made of the other material. However, the linear member 30 should have a thickness that can secure a sufficient space in the flat type heat transferring device.
In the meantime, it is preferable that the part where the linear member 30 is woven in the capillary wick 21 is formed to be relatively sparse than the other part.
That is, the gap between the vertical lines 23 where the linear member 30 is located is formed to be broad, while the gap between the vertical line 23 and the vertical line 23 is formed to be relatively narrow.
As to another embodiment of the present invention, the other linear member 30 having a different thick is woven together when the linear member 30 is woven. Therefore, according to the present invention, the structure of combining the linear member 30 with the capillary wick 21 is facilitated. In some cases, the linear member 30 performs the auxiliary function of generating the capillary force with the capillary wick 21, thereby, it can contribute to enhance the cooling efficiency.
FIG. 13 and FIG. 14 are a drawing showing the configuration of another embodiment of a linear member used in the present invention.
FIG. 13 is formed with structure in which the linear member 30 is foamy. Thus, the linear member 30 itself has a capillary force.
That is, as to the foaming linear member 30, as the inside is formed with the porous structure, it has the space in which the liquid coolant can flow. Accordingly, the capillary force can be improved with the capillary wick 21 such that it can contribute to enhance the cooling efficiency.
Here, the foaming linear member 30 is, on the whole, configured to improve the cooling efficiency with making the weight of the flat type heat transferring device light. The method of combining the capillary wick 21 is available with various methods as the above-described different embodiment.
FIG. 14 is a drawing showing a structure that the linear member 30 is formed with a bundle structure, thus, it can improve a capillary force.
That is, as to one linear member 30, several wires w having a small wire diameter forms one bindle to combine with the capillary wick 21. For example, the linear member 30 can be formed with the structure of Nano Tube.
In this case, as the linear member 30 is formed with the bundle structure, the surface area is enlarged through each wire w, thereby, the capillary force can be improved.
FIG. 15 and FIG. 16 are drawings of an embodiment showing the configuration of arranging an unistructure to the flat type tube structure with a multiple-structure.
As to the flat type heat transferring device of this embodiment, differently with the above-described embodiment, the case 10 is not configured by welding the first plate 11 and the second plate 12, but configured with one flat type tube 15 forming the outer cell. The unistructure 20 in which the capillary wick 21 and the linear member 30 are combined is installed at the inside of the case 10.
Here, as to the flat type tube 15, a cylindrical tube having a fixed length is pressed into the plate type structure. After the press processing, it is configured that an unistructure 20 and a coolant are inserted into the inside, with sealing both opening part.
Hereinafter, the unistructure shown in FIG. 15 and FIG. 16 will be illustrated. In this embodiment, 20 it is exemplified that the unistructure 20 is formed in the flat type tube 15. However, it is not thus restricted and, like the embodiment described in the above, it can be applicable to the case 10 comprised of the first plate 11 and the second plate 12.
In FIG. 15, the configuration that the unistructure 20 in which the linear member 30 is combined with the capillary wick 21 is arranged within the flat type tube with a multiplet structure (double structure in the drawing) is shown.
FIG. 16 shows the configuration of arranging the capillary wick 21 with a multiplet structure within the flat type tube, and combining the linear member 30 in the inside to arrange the unistructure 20.
In the meantime, in the present invention, the capillary wick 21 can use a synthetic fiber material having a porous structure besides a weaved body. It is a seat structure which is formed to have a porous structure with the flat type so as to generate the capillary phenomena. The capillary wick 21 made of a porosity synthetic fiber material can be comprised of a foamed sheet, or a net body where a plurality of holes are formed.
Further, the capillary wick can be comprised of a groove sheet in which a plurality of grooves or holes are formed in a metal or a plastic combinations sheet besides the porosity synthetic fiber material.
Besides, as to the capillary wick 21 having a well known seat structure used in the flat type heat transferring device, as described above, the linear member 30 having a relatively large wire diameter can be combined to apply.
As described above, as to the flat type heat transferring device and the manufacturing method of the same according to the present invention, the capillary wick and the linear member are combined to form an unistructure, thereby, it has the following effects.
Firstly, as to the present invention, the capillary wick and linear member are formed with an unistructure. Therefore, when the flat type heat transferring device is assembled, it is needless to separately assemble it. Hence, the assembly can be performed at a time, and thus, the assembling structure can be simple. Moreover, the cost relating to the assembly can be also cut down. Thus, on the whole, it has the advantage of reducing the manufacturing cost of the flat type heat transferring device.
Further, in the present invention, the linear member is combined with the capillary wick as if it is inserted into the capillary wick. Therefore, the rigidity which is mechanically sufficient and stabilized can be secured in the inside of the flat type heat transferring device. Accordingly, it has the advantage of strengthening a durability with enhancing the flexibility of the flat type heat transferring device.
Further, in the present invention, since the capillary wick and the linear member are formed with an unistructure, the thickness becomes small in comparison with the conventional flat type heat transferring device using an additional support, thereby, an ultra thin configuration can be available, and it has the advantage of the light weight depending on the material of the linear member.
Further, in the present invention, it has the advantage that the manufacture of the unistructure can be facilitated in case of weaving the linear member together in weaving the capillary wick.
Further, in the present invention, it has the advantage that the unistructure can be manufactured by simply inserting the linear member into the capillary wick in case of inserting the linear member by folding the capillary wick.
Particularly, in the present invention, the unistructure is manufactured by combining the linear member without altering the structure of the capillary wick, thereby, the problem of degrading the capillary force is resolves. Additionally, it has the advantage of improving the cooling efficiency with increasing the capillary force in case the linear member has a capillary force.
At the same time, the linear member combines with the top and the bottom of the capillary wick. Therefore, the channel of the vapor coolant as well as the channel of the liquid coolant can be adequately secured. Accordingly, the flow of the liquid coolant can be more smoothly performed, thereby, it has the advantage of improving the cooling efficiency of a thermal medium.
It will be apparent to those skilled in the art that various modifications and variation can be made in the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.

Claims

1. A flat type heat transferring device, comprising:

a case of flat structure forming a sealed internal space;

a coolant injected into the inside of the case; and

an uniweave structure including a capillary wick that is provided in the inside of the case and is formed by weaving a wire in the horizontal direction and the vertical direction so as to absorb a liquid coolant, and

a linear member that is formed to have a different wire diameter from the wire of the capillary wick and woven in the capillary wick to form a space where a vapor coolant flows.

2. The device of claim 1, wherein the case is comprised of a first plate and a second plate forming a sealed internal space, while they form an upper surface and a lower surface respectively.

3. The device of claim 1, wherein the case is comprised of a flat type tube forming the outer cell.

4. The device of claim 1, wherein the wire diameter of the linear member is formed to be larger than the diameter of the wire forming the capillary wick.

5. The device of claim 1, wherein a plurality of the linear members are woven in the capillary wick.

6. The device of claim 5, wherein the plurality of the linear members are arranged in parallel with the capillary wick.

7. The device of claim 5, wherein the exposed locations of the plurality of linear members woven in the capillary wick are positioned to be opposed to the exposed locations of the adjacent linear member.

8. The device of claim 5, wherein the exposed locations of the plurality of linear members woven in the capillary wick are positioned to be identical with the exposed locations of the adjacent linear member.

9. The device of claim 1, wherein the linear member is implemented in the capillary wick with a structure woven with a zigzag form.

10. The device of claim 1, wherein the linear member is formed with one or more materials among metal, plastic combinations, glass, and graphite.

11. The device of claim 1, wherein the linear member is formed with a porous material.

12. The device of claim 1, wherein the linear member is formed with a bundle structure collecting a plurality of wires.

13. The device of claim 1, wherein an uniweave structure in which the linear member is combined with the capillary wick is arranged with a multiplet structure within the case.

14. The device of claim 1, wherein the capillary wick is arranged with a multiplet structure; and the linear member is inserted into the gap between the capillary wicks to combine.

15. A flat type heat transferring device, comprising: a case of flat structure forming a sealed internal space;

a coolant injected inside the case;

a capillary wick that is provided inside the case and absorbs a liquid coolant; and

a linear member that is combined with the capillary wick and inserted into the capillary wick to form a space where a vapor coolant flows.

16. The device of claim 1, wherein the capillary wick is made of a porosity sheet.

17. The device of claim 1, wherein the capillary wick is made of a groove sheet having a plurality of grooves or holes.

18. A manufacturing method of the flat type heat transferring device of claim 1, wherein an uniweave structure for an internal space of the case is manufactured by weaving the linear member together in the process of weaving the horizontal wire and the vertical wire.

19. A manufacturing method of the flat type heat transferring device of claim 1, the method comprising:

forming one or more cut-out parts so as to insert the linear member into the capillary wick in a constant distance; and

manufacturing an uniweave structure for an internal space of the case by inserting the linear member into the capillary wick in which the cut-out part is formed.

20. The manufacturing method of claim 19, wherein the cut-out part is formed by using a press die.

21. A manufacturing method of the flat type heat transferring device of claim 1, the method comprising:

folding the capillary wick with a zigzag form to arrange;

inserting the linear member into the arranged capillary wick; and

unfolding the capillary wick to manufacture the uniweave structure for the internal space of the flat type heat transferring device.

22. The manufacturing method of claim 21, wherein, when the linear member is inserted into the capillary wick, firstly an insertion pipe is inserted into the capillary wick; and the linear member is inserted into the insertion pipe.