US20100139894A1 - Heat sink with vapor chamber - Google Patents

Heat sink with vapor chamber Download PDF

Info

Publication number
US20100139894A1
US20100139894A1 US12/436,785 US43678509A US2010139894A1 US 20100139894 A1 US20100139894 A1 US 20100139894A1 US 43678509 A US43678509 A US 43678509A US 2010139894 A1 US2010139894 A1 US 2010139894A1
Authority
US
United States
Prior art keywords
wick layer
heat sink
supporting member
tank
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/436,785
Inventor
Zhi-Yong Zhou
Qiao-Li Ding
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Foxconn Technology Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Assigned to FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD. reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DING, QIAO-LI, ZHOU, ZHI-YONG
Publication of US20100139894A1 publication Critical patent/US20100139894A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the disclosure relates to a heat sink with vapor chamber and, more particularly, to a heat sink with vapor chamber having firm structure.
  • a vapor chamber type heat sink is a common structure of the heat sinks.
  • the heat sink includes a plate shaped heat spreader thermally contacting the electronic device.
  • a vacuum chamber is defined in the heat spreader.
  • a wick structure is formed on an inner face of the chamber, and a working fluid is contained in the chamber.
  • the working fluid contained in the chamber corresponding to a hotter location vaporizes into vapor.
  • the vapor then spreads to fill the chamber, and wherever the vapor comes into contact with a cooler location of the chamber, it releases its latent heat and condenses.
  • the condensate returns to the hotter location via a capillary force generated by the wick structure. Thereafter, the working fluid frequently vaporizes and condenses to form a circulation to thereby remove the heat generated by the electronic device.
  • the heat spreader of the heat sink is prone to deforming when subjected to an inner or outer pressure during use, which further results in the wick structure disengagement from the inner face of the chamber, adversely affecting the stability of the heat sink.
  • FIG. 1 is an isometric, assembled view of a heat sink in accordance with an embodiment of the disclosure.
  • FIG. 2 is an isometric, exploded view of the heat sink of FIG. 1 .
  • FIG. 3 is an enlarged view of a supporting member of the heat sink of FIG. 2 .
  • FIG. 4 is a sectional view of FIG. 1 , taken along a line IV-IV thereof.
  • FIG. 5 is an enlarged view of a part V shown in FIG. 4 .
  • a heat sink in accordance with an embodiment of the disclosure comprises a heat spreader 10 , a tank 20 on the heat spreader 10 , a first wick layer 30 disposed in the tank 20 , a second wick layer 40 disposed on the heat spreader 10 and a supporting member 50 positioned between the first and second wick layers 30 , 40 .
  • the tank 20 comprises a body 22 and a flange 24 circumferentially and outwardly extending from the body 22 .
  • the body 22 comprises a central plate 222 and four interconnecting sidewalls 224 integrally extending downwardly from the central plate 222 .
  • the heat spreader 10 has an edge thereof hermetically engaging with the flange 24 of the tank 20 , thereby defining a chamber 26 between the heat spreader 10 and the tank 20 .
  • a working fluid (not labeled) is filled in the chamber 20 .
  • the first wick layer 30 includes a central portion 32 and four interconnecting side portions 34 integrally extending downwardly from the central portion 32 .
  • the central portion 32 of the first wick layer 30 is formed on an inner face of the central plate 222 of the tank 20 .
  • the first wick layer 30 is a sintered wick layer which is formed from sintering metal power.
  • the second wick layer 40 includes a central portion 42 and four interconnecting side portions 44 integrally extending upwardly from the central portion 42 .
  • the central portion 42 of the second wick layer 40 is formed on an inner face of the heat spreader 10 and enclosed by the tank 20 .
  • the side portions 44 of the second wick layer 40 has outer faces adhered on the four sidewalls 224 of the body 22 of the tank 20 , and inner faces engaging with the side portions 34 of the first wick layer 30 , thus the first wick layer 30 is accommodated in the second wick layer 40 , and the first wick layer 30 and the second wick layer 40 are in communication, therefore, the working fluid can flow between the first wick layer 30 and the second wick layer 40 via capillary forces generated therefrom.
  • the second wick layer 40 is a meshed wick layer which is formed from a mesh.
  • the supporting member 50 is integrally made from a sheet with a high strength.
  • the supporting member 50 is arranged in a wave shape.
  • the supporting member 50 includes a plurality of first supporting portions 52 contacting the central portion 32 of the first wick layer 30 , a plurality of second supporting portions 54 contacting the central portion 42 of the second wick layer 40 and a plurality of connecting portions 56 interconnecting the first and second supporting portions 52 , 54 .
  • the first supporting portions 52 are parallel to the second supporting portions 54 .
  • Each first supporting portion 52 has a first flat face contacting the central portion 32 of the first wick layer 30 .
  • Each second supporting portion 54 has a second flat face contacting the central portion 42 of the second wick layer 40 .
  • a region between each supporting portion and two adjacent connecting portions 56 at two ends thereof has a trapezoid cross section.
  • the first and second supporting portions 52 , 54 divide the chamber 26 into a plurality of spaced cavities 260 .
  • the connecting portions 56 each define a plurality of spaced, rectangular holes 560 in communication with two adjacent cavities 260 , so that the vaporized working fluid can flow through the holes 560 of the connecting portions 56 .
  • the heat spreader 10 of the heat sink thermally contacts and absorbs heat from a heat-generating source.
  • the working fluid in the chamber 26 is heated and vaporized to flow upwardly through the holes 560 of the connecting portions 56 to reach the central plate 222 of the tank 20 .
  • the vaporized working fluid exchanges heat with the central plate 222 and then is condensed to liquid.
  • the condensing working fluid returns to the heat spreader 10 via the first wick layer 30 and the second wick layer 40 .
  • the supporting member 50 in the chamber 26 can support the heat spreader 10 and the tank 20 to prevent the first and second wick layers 30 , 40 from deforming, and prevent the first and second wick layers 30 , 40 from disengaging from the heat spreader 10 and the tank 20 ; thus, the heat sink in accordance with the present disclosure can have a normal function even when it is subjected to a large internal vapor pressure or an external vibration.

Abstract

A heat sink includes a heat spreader for absorbing heat from a heat-generating source, a tank covering on the heat spreader and hermetically engaging with the heat spreader, a first wick layer formed on an inner face of the tank, a second wick layer formed on an inner face of the heat spreader, and a supporting member located between the tank and the heat spreader. A chamber is defined between the tank and the heat spreader and contains working fluid therein. The supporting member is arranged in a wave shape and supports the first wick layer and the second wick layer.

Description

    BACKGROUND
  • 1. Technical Field
  • The disclosure relates to a heat sink with vapor chamber and, more particularly, to a heat sink with vapor chamber having firm structure.
  • 2. Description of Related Art
  • Nowadays, numerous heat sinks are used to dissipate heat generated by electronic devices. A vapor chamber type heat sink is a common structure of the heat sinks. Generally, the heat sink includes a plate shaped heat spreader thermally contacting the electronic device. A vacuum chamber is defined in the heat spreader. A wick structure is formed on an inner face of the chamber, and a working fluid is contained in the chamber. As the electronic device is maintained in thermal contact with the heat spreader, the working fluid contained in the chamber corresponding to a hotter location vaporizes into vapor. The vapor then spreads to fill the chamber, and wherever the vapor comes into contact with a cooler location of the chamber, it releases its latent heat and condenses. The condensate returns to the hotter location via a capillary force generated by the wick structure. Thereafter, the working fluid frequently vaporizes and condenses to form a circulation to thereby remove the heat generated by the electronic device.
  • However, the heat spreader of the heat sink is prone to deforming when subjected to an inner or outer pressure during use, which further results in the wick structure disengagement from the inner face of the chamber, adversely affecting the stability of the heat sink.
  • What is needed, therefore, is a heat sink which can overcome the limitations described.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an isometric, assembled view of a heat sink in accordance with an embodiment of the disclosure.
  • FIG. 2 is an isometric, exploded view of the heat sink of FIG. 1.
  • FIG. 3 is an enlarged view of a supporting member of the heat sink of FIG. 2.
  • FIG. 4 is a sectional view of FIG. 1, taken along a line IV-IV thereof.
  • FIG. 5 is an enlarged view of a part V shown in FIG. 4.
    •  DETAILED DESCRIPTION
  • Referring to FIGS. 1-2, a heat sink in accordance with an embodiment of the disclosure comprises a heat spreader 10, a tank 20 on the heat spreader 10, a first wick layer 30 disposed in the tank 20, a second wick layer 40 disposed on the heat spreader 10 and a supporting member 50 positioned between the first and second wick layers 30, 40.
  • Also referring to FIGS. 4-5, the tank 20 comprises a body 22 and a flange 24 circumferentially and outwardly extending from the body 22. The body 22 comprises a central plate 222 and four interconnecting sidewalls 224 integrally extending downwardly from the central plate 222. The heat spreader 10 has an edge thereof hermetically engaging with the flange 24 of the tank 20, thereby defining a chamber 26 between the heat spreader 10 and the tank 20. A working fluid (not labeled) is filled in the chamber 20.
  • The first wick layer 30 includes a central portion 32 and four interconnecting side portions 34 integrally extending downwardly from the central portion 32. The central portion 32 of the first wick layer 30 is formed on an inner face of the central plate 222 of the tank 20. The first wick layer 30 is a sintered wick layer which is formed from sintering metal power.
  • The second wick layer 40 includes a central portion 42 and four interconnecting side portions 44 integrally extending upwardly from the central portion 42. The central portion 42 of the second wick layer 40 is formed on an inner face of the heat spreader 10 and enclosed by the tank 20. The side portions 44 of the second wick layer 40 has outer faces adhered on the four sidewalls 224 of the body 22 of the tank 20, and inner faces engaging with the side portions 34 of the first wick layer 30, thus the first wick layer 30 is accommodated in the second wick layer 40, and the first wick layer 30 and the second wick layer 40 are in communication, therefore, the working fluid can flow between the first wick layer 30 and the second wick layer 40 via capillary forces generated therefrom. The second wick layer 40 is a meshed wick layer which is formed from a mesh.
  • Also referring to FIG. 3, the supporting member 50 is integrally made from a sheet with a high strength. The supporting member 50 is arranged in a wave shape. The supporting member 50 includes a plurality of first supporting portions 52 contacting the central portion 32 of the first wick layer 30, a plurality of second supporting portions 54 contacting the central portion 42 of the second wick layer 40 and a plurality of connecting portions 56 interconnecting the first and second supporting portions 52, 54. The first supporting portions 52 are parallel to the second supporting portions 54. Each first supporting portion 52 has a first flat face contacting the central portion 32 of the first wick layer 30. Each second supporting portion 54 has a second flat face contacting the central portion 42 of the second wick layer 40. A region between each supporting portion and two adjacent connecting portions 56 at two ends thereof has a trapezoid cross section. The first and second supporting portions 52, 54 divide the chamber 26 into a plurality of spaced cavities 260. The connecting portions 56 each define a plurality of spaced, rectangular holes 560 in communication with two adjacent cavities 260, so that the vaporized working fluid can flow through the holes 560 of the connecting portions 56.
  • In use, the heat spreader 10 of the heat sink thermally contacts and absorbs heat from a heat-generating source. The working fluid in the chamber 26 is heated and vaporized to flow upwardly through the holes 560 of the connecting portions 56 to reach the central plate 222 of the tank 20. The vaporized working fluid exchanges heat with the central plate 222 and then is condensed to liquid. The condensing working fluid returns to the heat spreader 10 via the first wick layer 30 and the second wick layer 40.
  • According to the disclosure, the supporting member 50 in the chamber 26 can support the heat spreader 10 and the tank 20 to prevent the first and second wick layers 30, 40 from deforming, and prevent the first and second wick layers 30, 40 from disengaging from the heat spreader 10 and the tank 20; thus, the heat sink in accordance with the present disclosure can have a normal function even when it is subjected to a large internal vapor pressure or an external vibration.
  • It is believed that the disclosure and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.

Claims (16)

1. A heat sink comprising:
a heat spreader for absorbing heat from a heat-generating source;
a tank covering on the heat spreader and hermetically engaging with the heat spreader;
a chamber defined between the tank and the heat spreader and containing working fluid therein;
a first wick layer formed on an inner face of the tank;
a second wick layer formed on an inner face of the heat spreader; and
a supporting member located in the chamber between the tank and the heat spreader, the supporting member having a wave shape and supporting the first wick layer and the second wick layer.
2. The heat sink of claim 1, wherein the supporting member is integrally made from a sheet, and defines a plurality of holes therein for the working fluid flowing therethrough.
3. The heat sink of claim 2, wherein the supporting member divides the chamber into a plurality of cavities in communication with each other via the holes of the supporting member.
4. The heat sink of claim 3, wherein the supporting member comprises a plurality of first supporting portions contacting the first wick layer, a plurality of second supporting portions contacting the second wick layer and a plurality of connecting portions interconnecting the first supporting portions and the second supporting portions, the plurality of hoes in the supporting member being defined in the connecting portions.
5. The heat sink of claim 1, wherein the first wick layer is received in and in communication with the second wick layer.
6. The heat sink of claim 1, wherein the tank comprises a body, the body comprising a central plate and a plurality of interconnecting sidewalls circumferentially extending from the central plate, the second wick layer comprising a central portion formed on the inner face of the heat spreader and a plurality of interconnecting side portions circumferentially extending from the central portion, the side portions of the second wick layer having outer faces adhered on the sidewalls of the body, the first wick layer being formed on the inner face of the central plate of the body.
7. The heat sink of claim 6, wherein the tank further comprises a flange circumferentially extending from the body, the heat spreader having an edge thereof hermetically engaging with the flange of the tank.
8. The heat sink of claim 6, wherein the first wick layer comprises a central portion formed on the inner face of the central plate of the body and a plurality of interconnecting side portions circumferentially extending from the central portion and engaging with inner faces of the side portions of the second wick layer.
9. The heat sink of claim 1, wherein the first wick layer is a sintered wick layer.
10. The heat sink of claim 1, wherein the second wick layer is a meshed wick layer.
11. A heat sink comprising:
a heat spreader;
a tank covering on the heat spreader and hermetically engaging with the heat spreader;
a chamber defined between the tank and the heat spreader and containing working fluid therein;
at least a wick layer formed on an inner face of the chamber; and
a supporting member located between the tank and the heat spreader; wherein the supporting member has a wave shape and supports the at least a wick layer.
12. The heat sink of claim 11, wherein the supporting member is integrally made from a sheet, and defines a plurality of holes therein for the working fluid flowing therethrough.
13. The heat sink of claim 12, wherein the supporting member divides the chamber into a plurality of cavities in communication with each other via the holes of the supporting member.
14. The heat sink of claim 13, wherein the supporting member comprises a plurality of supporting portions contacting the at least a wick layer and a plurality of connecting portions interconnecting the supporting portions, the plurality of hoes in the supporting member being defined in the connecting portions.
15. The heat sink of claim 14, wherein a region between each supporting portion and two adjacent connecting portions at two ends of the supporting portion has a trapezoid cross section.
16. The heat sink of claim 11, wherein the number of the at least a wick layer is two, a first wick layer being formed on an inner face of the tank, a second wick layer being formed on an inner face of the heat spreader, the first wick layer being received in and in communication with the second wick layer.
US12/436,785 2008-12-08 2009-05-07 Heat sink with vapor chamber Abandoned US20100139894A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200810306034.8 2008-12-08
CN200810306034A CN101754653A (en) 2008-12-08 2008-12-08 Radiator

Publications (1)

Publication Number Publication Date
US20100139894A1 true US20100139894A1 (en) 2010-06-10

Family

ID=42229775

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/436,785 Abandoned US20100139894A1 (en) 2008-12-08 2009-05-07 Heat sink with vapor chamber

Country Status (2)

Country Link
US (1) US20100139894A1 (en)
CN (1) CN101754653A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090205812A1 (en) * 2008-02-14 2009-08-20 Meyer Iv George Anthony Isothermal vapor chamber and support structure thereof
US20100006268A1 (en) * 2008-07-14 2010-01-14 Meyer Iv George Anthony Vapor chamber and supporting structure of the same
US20100326629A1 (en) * 2009-06-26 2010-12-30 Meyer Iv George Anthony Vapor chamber with separator
US20110027738A1 (en) * 2009-07-30 2011-02-03 Meyer Iv George Anthony Supporting structure with height difference and vapor chamber having the supporting structure
US20110048341A1 (en) * 2009-09-03 2011-03-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Vapor chamber and method for manufacturing the same
US20120148967A1 (en) * 2010-12-13 2012-06-14 Thomas Thomas J Candle wick including slotted wick members
US20180066898A1 (en) * 2016-09-08 2018-03-08 Taiwan Microloops Corp. Vapor chamber structure
US20190285357A1 (en) * 2018-03-19 2019-09-19 Asia Vital Components Co., Ltd. Middle member of heat dissipation device and the heat dissipation device
US20190285353A1 (en) * 2018-03-19 2019-09-19 Asia Vital Components Co., Ltd. Middle member of heat dissipation device and the heat dissipation device
US20200029467A1 (en) * 2018-07-20 2020-01-23 Chiun Mai Communication Systems, Inc. Heat sink and electronic device using same
US20210168969A1 (en) * 2018-05-30 2021-06-03 Dai Nippon Printing Co., Ltd. Vapor chamber and electronic device
WO2022181629A1 (en) * 2021-02-25 2022-09-01 日本電産株式会社 Thermally conductive member and heat exchange device
WO2022181632A1 (en) * 2021-02-25 2022-09-01 日本電産株式会社 Thermally conductive member and heat exchange device
WO2022181631A1 (en) * 2021-02-25 2022-09-01 日本電産株式会社 Thermally conductive member and heat exchange device
US11454455B2 (en) * 2019-01-31 2022-09-27 Auras Technology Co., Ltd. Vapor chamber and heat dissipation device with same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102155858A (en) * 2011-04-07 2011-08-17 大连金三维科技有限公司 Radiator
CN103419922B (en) * 2013-07-24 2015-11-25 中国人民解放军国防科学技术大学 A kind of laminated board type leading edge structure of aircraft
CN103940266B (en) * 2014-03-26 2016-02-10 上海应用技术学院 Capillary type heat-exchange device

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3697935A (en) * 1970-12-04 1972-10-10 Kulka Electric Corp Terminal junction
US20020020518A1 (en) * 2000-05-22 2002-02-21 Li Jia Hao Supportive wick structure of planar heat pipe
US20050155745A1 (en) * 2003-12-22 2005-07-21 Fujikura Ltd. Vapor chamber
US7032652B2 (en) * 2004-07-06 2006-04-25 Augux Co., Ltd. Structure of heat conductive plate
US20080053640A1 (en) * 2006-08-31 2008-03-06 International Business Machines Corporation Compliant vapor chamber chip packaging
US20080283222A1 (en) * 2007-05-18 2008-11-20 Foxconn Technology Co., Ltd. Heat spreader with vapor chamber and heat dissipation apparatus using the same
US20080307651A1 (en) * 2007-06-13 2008-12-18 The Boeing Company Heat pipe dissipating system and method
US20090025910A1 (en) * 2007-07-27 2009-01-29 Paul Hoffman Vapor chamber structure with improved wick and method for manufacturing the same
US7770631B2 (en) * 2008-03-19 2010-08-10 Chin-Wen Wang Method for manufacturing supporting body within an isothermal plate and product of the same

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3697935A (en) * 1970-12-04 1972-10-10 Kulka Electric Corp Terminal junction
US20020020518A1 (en) * 2000-05-22 2002-02-21 Li Jia Hao Supportive wick structure of planar heat pipe
US20050155745A1 (en) * 2003-12-22 2005-07-21 Fujikura Ltd. Vapor chamber
US7137442B2 (en) * 2003-12-22 2006-11-21 Fujikura Ltd. Vapor chamber
US7032652B2 (en) * 2004-07-06 2006-04-25 Augux Co., Ltd. Structure of heat conductive plate
US20080053640A1 (en) * 2006-08-31 2008-03-06 International Business Machines Corporation Compliant vapor chamber chip packaging
US20080283222A1 (en) * 2007-05-18 2008-11-20 Foxconn Technology Co., Ltd. Heat spreader with vapor chamber and heat dissipation apparatus using the same
US20080307651A1 (en) * 2007-06-13 2008-12-18 The Boeing Company Heat pipe dissipating system and method
US20090025910A1 (en) * 2007-07-27 2009-01-29 Paul Hoffman Vapor chamber structure with improved wick and method for manufacturing the same
US7770631B2 (en) * 2008-03-19 2010-08-10 Chin-Wen Wang Method for manufacturing supporting body within an isothermal plate and product of the same

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090205812A1 (en) * 2008-02-14 2009-08-20 Meyer Iv George Anthony Isothermal vapor chamber and support structure thereof
US20100006268A1 (en) * 2008-07-14 2010-01-14 Meyer Iv George Anthony Vapor chamber and supporting structure of the same
US20100326629A1 (en) * 2009-06-26 2010-12-30 Meyer Iv George Anthony Vapor chamber with separator
US20110027738A1 (en) * 2009-07-30 2011-02-03 Meyer Iv George Anthony Supporting structure with height difference and vapor chamber having the supporting structure
US20110048341A1 (en) * 2009-09-03 2011-03-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Vapor chamber and method for manufacturing the same
US20120148967A1 (en) * 2010-12-13 2012-06-14 Thomas Thomas J Candle wick including slotted wick members
US20180066898A1 (en) * 2016-09-08 2018-03-08 Taiwan Microloops Corp. Vapor chamber structure
US10018427B2 (en) * 2016-09-08 2018-07-10 Taiwan Microloops Corp. Vapor chamber structure
US20190285357A1 (en) * 2018-03-19 2019-09-19 Asia Vital Components Co., Ltd. Middle member of heat dissipation device and the heat dissipation device
US20190285353A1 (en) * 2018-03-19 2019-09-19 Asia Vital Components Co., Ltd. Middle member of heat dissipation device and the heat dissipation device
US11131508B2 (en) * 2018-03-19 2021-09-28 Asia Vital Components Co., Ltd. Middle member of heat dissipation device and the heat dissipation device
US20210168969A1 (en) * 2018-05-30 2021-06-03 Dai Nippon Printing Co., Ltd. Vapor chamber and electronic device
US11903167B2 (en) * 2018-05-30 2024-02-13 Dai Nippon Printing Co., Ltd. Vapor chamber with condensate flow paths disposed on wall parts
US20200029467A1 (en) * 2018-07-20 2020-01-23 Chiun Mai Communication Systems, Inc. Heat sink and electronic device using same
US10806051B2 (en) * 2018-07-20 2020-10-13 Chiun Mai Communication Systems, Inc. Heat sink and electronic device using same
US11454455B2 (en) * 2019-01-31 2022-09-27 Auras Technology Co., Ltd. Vapor chamber and heat dissipation device with same
WO2022181629A1 (en) * 2021-02-25 2022-09-01 日本電産株式会社 Thermally conductive member and heat exchange device
WO2022181632A1 (en) * 2021-02-25 2022-09-01 日本電産株式会社 Thermally conductive member and heat exchange device
WO2022181631A1 (en) * 2021-02-25 2022-09-01 日本電産株式会社 Thermally conductive member and heat exchange device

Also Published As

Publication number Publication date
CN101754653A (en) 2010-06-23

Similar Documents

Publication Publication Date Title
US20100139894A1 (en) Heat sink with vapor chamber
US8316921B2 (en) Plate type heat pipe and heat sink using the same
US20120111541A1 (en) Plate type heat pipe and heat sink using the same
US7484553B2 (en) Heat pipe incorporating outer and inner pipes
US7599185B2 (en) Cooling device
US10119766B2 (en) Heat dissipation device
US10077945B2 (en) Heat dissipation device
US8377214B2 (en) Vapor chamber and method for manufacturing the same
US20120307453A1 (en) Electronic device with heat pipe chamber cover for dissipating heat
US7331379B2 (en) Heat dissipation device with heat pipe
US7753109B2 (en) Heat dissipation device with heat pipes
US7942196B2 (en) Heat spreader with vapor chamber
US20070217154A1 (en) Vapor chamber for dissipation heat generated by electronic component
US20100326630A1 (en) Heat spreader with vapor chamber and method for manufacturing the same
US20090151906A1 (en) Heat sink with vapor chamber
US20070051498A1 (en) Heat dissipation device with a heat pipe
US20130048251A1 (en) Heat dissipation device incorporating heat spreader
US20100155030A1 (en) Thermal module
US20100139893A1 (en) Heat spreader with vapor chamber
US7537046B2 (en) Heat dissipation device with heat pipe
US20080093052A1 (en) Heat dissipation device with heat pipes
US20110232874A1 (en) Heat dissipation apparatus with heat pipe
US20090151905A1 (en) Heat sink with vapor chamber
CN211429852U (en) Heat dissipation plate and electronic device with same
US20080314554A1 (en) Heat dissipation device with a heat pipe

Legal Events

Date Code Title Description
AS Assignment

Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.,C

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZHOU, ZHI-YONG;DING, QIAO-LI;REEL/FRAME:022649/0334

Effective date: 20090421

Owner name: FOXCONN TECHNOLOGY CO., LTD.,TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZHOU, ZHI-YONG;DING, QIAO-LI;REEL/FRAME:022649/0334

Effective date: 20090421

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION