US20110088876A1 - Plate-type heat pipe - Google Patents
Plate-type heat pipe Download PDFInfo
- Publication number
- US20110088876A1 US20110088876A1 US12/685,619 US68561910A US2011088876A1 US 20110088876 A1 US20110088876 A1 US 20110088876A1 US 68561910 A US68561910 A US 68561910A US 2011088876 A1 US2011088876 A1 US 2011088876A1
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- US
- United States
- Prior art keywords
- plate
- wick
- heat pipe
- type heat
- members
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
Definitions
- the present disclosure relates to heat pipes and, more particularly, to a plate-type heat pipe having good heat dissipation efficiency and stable and reliable performance.
- plate-type heat pipes efficiently dissipate heat from heat-generating components such as a central processing unit (CPU) of a computer.
- a conventional plate-type heat pipe comprises a top plate and a bottom cover hermetically contacting the top plate to form a container.
- a continuous wick structure is adhered to inner surfaces of the top plate and the bottom cover.
- Working fluid is contained in the container. All parts of the wick structure have the same thickness.
- the wick structure intervenes between the vaporized working fluid and the inner surface of the top plate at which the vaporized working fluid can release its latent heat of vaporization and change into condensate. Therefore, the wick structure tends to retard the phase change occurring at the top plate.
- the heat may transfer to the ambient environment too slowly, and is thus liable to accumulate on the container formed by the top plate and the bottom cover. In due course, the plate-type heat pipe may be overheat, and the heat dissipation efficiency of the plate-type heat pipe is reduced.
- FIG. 1 is a cross-sectional view of a plate-type heat pipe in accordance with a first embodiment of the present disclosure, the plate-type heat pipe including a condensing plate, a first wick member, and a second wick member.
- FIG. 2 is an isometric, inverted view of the condensing plate of FIG. 1 , showing the first wick member mounted on the condensing plate.
- FIG. 3 is an enlarged, cross-sectional view of part of the condensing plate with the first wick member, corresponding to line of FIG. 2 .
- FIG. 4 is similar to FIG. 3 , but showing part of a condensing plate arrangement of a plate-type heat pipe in accordance with a second embodiment of the present disclosure, with a first wick member and a number of third wick members mounted on the condensing plate.
- FIG. 5 is similar to FIG. 3 , but showing part of a condensing plate arrangement of a plate-type heat pipe in accordance with a third embodiment of the present disclosure, with a first wick member and a number of third wick members mounted on the condensing plate.
- FIG. 6 is similar to FIG. 3 , but showing part of a condensing plate arrangement of a plate-type heat pipe in accordance with a fourth embodiment of the present disclosure, with a first wick member and a number of third wick members mounted on the condensing plate.
- the plate-type heat pipe comprises a hermetic container 10 , a continuous wick structure 30 mounted on an inner surface of the container 10 , and working fluid (not shown) contained in the container 10 .
- the container 10 is made of copper, aluminum, or an alloy thereof, and comprises an elongated condensing plate 11 and a bowl-shaped evaporating plate 13 hermetically contacting the condensing plate 11 .
- the evaporating plate 13 absorbs heat generated by one or more components (not shown) such as electronic devices.
- the condensing plate 11 dissipates heat transferred from the evaporating plate 13 to the ambient environment.
- the evaporating plate 13 comprises an elongated heat absorbing portion 131 , two transition portions 133 , two extending portions 134 , and two sidewalls 135 .
- the transition portions 133 extend outwardly and upwardly from opposite ends of the heat absorbing portion 131 , respectively, and are symmetrically opposite each other.
- the extending portions 134 extend outwardly along opposite horizontal directions from outer ends of the transition portions 133 , respectively.
- the sidewalls 135 extend upwardly from outer ends of the extending portions 134 , respectively.
- top ends of the sidewalls 135 are integrally formed with two ends of the condensing plate 11 . That is, the evaporating plate 13 and the condensing plate 11 are a single body of the same material without any seams.
- the wick structure 30 is made of metallic powder by a sintering process.
- the wick structure 30 comprises a first wick member 31 and a second wick member 33 .
- the first wick member 31 is adhered to an inner surface of the condensing plate 11 .
- the second wick member 33 is adhered to an inner surface of the evaporating plate 13 .
- Opposite ends of the second wick member 33 connect opposite ends of the first wick member 31 , respectively, thereby forming the continuous wick structure 30 .
- the second wick member 33 comprises an elongated first wick portion 331 , two second wick portions 333 , two third wick portions 335 , and two fourth wick portions 337 .
- the first wick portion 331 is adhered to a top surface of the heat absorbing portion 131 of the evaporating plate 13 .
- the first wick portion 331 is thinner than each of the second wick portions 333 .
- the working fluid contained in the first wick portion 331 is vaporized faster than the working fluid contained in the second wick portion 333 . Accordingly, the heat of the heat absorbing portion 131 is transferred by the first wick portion 331 quickly.
- the second wick portions 333 extend upwardly and outwardly from opposite ends of the first wick portion 331 , respectively, and are symmetrically opposite each other.
- the second wick portions 333 are adhered to top surfaces of the transition portions 133 of the evaporating plate 13 .
- the third wick portions 335 are horizontal, and extend outwardly from the second wick portions 333 , respectively.
- the third wick portions 335 are adhered to top surfaces of the extending portions 134 of the evaporating plate 13 .
- Each fourth wick portion 337 is adhered to an inner surface of the corresponding sidewall 135 of the evaporating plate 13 , and fills a corner formed by the sidewall 135 and the corresponding extending portion 134 .
- each fourth wick portion 337 is substantially triangular. That is, a transverse thickness (horizontal, from left to right, as viewed in FIG. 1 ) of the fourth wick portion 337 progressively decreases from a bottom end of the fourth wick portion 337 central to a top end of the fourth wick portion 337 .
- the first wick member 31 is elongated and defines a plurality of through holes 313 therein.
- the through holes 313 are square or rectangular through holes 313 , and are arranged in a regular m ⁇ n array.
- the first wick member 31 guides the condensed working fluid back to the opposite ends of the second wick member 33 of the evaporating plate 13 .
- a bottom surface of the first wick member 31 is spaced from a top surface of the first wick portion 331 , from top surfaces of the second wick portions 333 , and from top surfaces of the third wick portions 335 .
- the through holes 313 are defined in the first wick member 31 , heat of at least some of the vaporized working fluid is absorbed by the condensing plate 11 directly. Therefore, unlike in other conventional plate-type heat pipes, there is little or even no retardation associated with a wick structure intervening between the vaporized working fluid and the condensing plate 11 . Thus, the heat dissipation efficiency of the present plate-type heat pipe is improved.
- the through holes 313 can be triangular, circular, oval-shaped, elliptical, etc.
- FIG. 4 shows showing part of a condensing plate arrangement of a plate-type heat pipe in accordance with a second embodiment of the present disclosure.
- a first wick member 31 and a number of third wick members 34 are adhered to an inner surface of a condensing plate 11 .
- the third wick members 34 fill top ends of the through holes 313 , respectively.
- Top end surfaces of the third wick members 34 and a top surface of the first wick member 31 are coplanar with one another.
- Each of the third wick members 34 has a same thickness.
- a ratio of the thickness of each third wick member 34 to a thickness of the first wick member 31 is in the range from about 1/10 to about 4 ⁇ 5.
- the third wick members 34 are thinner than the first wick member 31 , paths of heat transfer of the vaporized working fluid to the condensing plate 11 are generally shorter than those of conventional plate-type heat pipes. Thus, the heat dissipation efficiency of the present plate-type heat pipe is improved.
- condensed working fluid contained in the third wick members 34 flows to the first wick member 31 to help drive the working fluid contained in the first wick member 31 to quickly flow back to the opposite ends of the second wick member 33 mounted on the evaporating plate 13 .
- stable and reliable performance of the plate-type heat pipe can be ensured.
- FIG. 5 shows showing part of a condensing plate arrangement of a plate-type heat pipe in accordance with a third embodiment of the present disclosure.
- a first wick member 31 and a number of third wick members 35 are adhered to an inner surface of a condensing plate 11 .
- a cross-section of each of the third wick members 35 is a trapezoid.
- Each third wick member 35 has a smaller end, and a larger end opposite to the smaller end. The smaller ends of the third wick members 35 are all oriented toward the same direction. The larger ends of the third wick members 35 are all thinner than the first wick member 31 .
- FIG. 6 shows showing part of a condensing plate arrangement of a plate-type heat pipe in accordance with a fourth embodiment of the present disclosure.
- a first wick member 31 and a plurality of third wick members 36 are adhered to an inner surface of a condensing plate 11 .
- a cross-section of each of the third wick members 36 is concave.
- the cross-section may for example be arcuate or arc-shaped. That is, a thickness of each third wick member 36 gradually increases from a central portion thereof to each of opposite ends thereof.
- the opposite ends of the third wick members 36 are all thinner than the first wick member 31 .
Abstract
Description
- 1. Technical Field
- The present disclosure relates to heat pipes and, more particularly, to a plate-type heat pipe having good heat dissipation efficiency and stable and reliable performance.
- 2. Description of Related Art
- Generally, plate-type heat pipes efficiently dissipate heat from heat-generating components such as a central processing unit (CPU) of a computer. A conventional plate-type heat pipe comprises a top plate and a bottom cover hermetically contacting the top plate to form a container. A continuous wick structure is adhered to inner surfaces of the top plate and the bottom cover. Working fluid is contained in the container. All parts of the wick structure have the same thickness. When the bottom cover of the plate-type heat pipe absorbs heat of the heat-generating component, the working fluid is vaporized and transfers heat to the ambient environment at the wick structure mounted on the top plate.
- The wick structure intervenes between the vaporized working fluid and the inner surface of the top plate at which the vaporized working fluid can release its latent heat of vaporization and change into condensate. Therefore, the wick structure tends to retard the phase change occurring at the top plate. The heat may transfer to the ambient environment too slowly, and is thus liable to accumulate on the container formed by the top plate and the bottom cover. In due course, the plate-type heat pipe may be overheat, and the heat dissipation efficiency of the plate-type heat pipe is reduced.
- What is needed, therefore, is a plate-type heat pipe having good heat dissipation efficiency and stable, reliable performance.
-
FIG. 1 is a cross-sectional view of a plate-type heat pipe in accordance with a first embodiment of the present disclosure, the plate-type heat pipe including a condensing plate, a first wick member, and a second wick member. -
FIG. 2 is an isometric, inverted view of the condensing plate ofFIG. 1 , showing the first wick member mounted on the condensing plate. -
FIG. 3 is an enlarged, cross-sectional view of part of the condensing plate with the first wick member, corresponding to line ofFIG. 2 . -
FIG. 4 is similar toFIG. 3 , but showing part of a condensing plate arrangement of a plate-type heat pipe in accordance with a second embodiment of the present disclosure, with a first wick member and a number of third wick members mounted on the condensing plate. -
FIG. 5 is similar toFIG. 3 , but showing part of a condensing plate arrangement of a plate-type heat pipe in accordance with a third embodiment of the present disclosure, with a first wick member and a number of third wick members mounted on the condensing plate. -
FIG. 6 is similar toFIG. 3 , but showing part of a condensing plate arrangement of a plate-type heat pipe in accordance with a fourth embodiment of the present disclosure, with a first wick member and a number of third wick members mounted on the condensing plate. - Referring to
FIGS. 1-2 , a plate-type heat pipe in accordance with a first embodiment of the present disclosure is shown. The plate-type heat pipe comprises ahermetic container 10, acontinuous wick structure 30 mounted on an inner surface of thecontainer 10, and working fluid (not shown) contained in thecontainer 10. - The
container 10 is made of copper, aluminum, or an alloy thereof, and comprises an elongatedcondensing plate 11 and a bowl-shapedevaporating plate 13 hermetically contacting thecondensing plate 11. The evaporatingplate 13 absorbs heat generated by one or more components (not shown) such as electronic devices. Thecondensing plate 11 dissipates heat transferred from the evaporatingplate 13 to the ambient environment. - The
evaporating plate 13 comprises an elongatedheat absorbing portion 131, twotransition portions 133, two extendingportions 134, and twosidewalls 135. Thetransition portions 133 extend outwardly and upwardly from opposite ends of theheat absorbing portion 131, respectively, and are symmetrically opposite each other. The extendingportions 134 extend outwardly along opposite horizontal directions from outer ends of thetransition portions 133, respectively. Thesidewalls 135 extend upwardly from outer ends of the extendingportions 134, respectively. In the illustrated embodiment, top ends of thesidewalls 135 are integrally formed with two ends of thecondensing plate 11. That is, theevaporating plate 13 and thecondensing plate 11 are a single body of the same material without any seams. - The
wick structure 30 is made of metallic powder by a sintering process. Thewick structure 30 comprises afirst wick member 31 and asecond wick member 33. Thefirst wick member 31 is adhered to an inner surface of thecondensing plate 11. Thesecond wick member 33 is adhered to an inner surface of the evaporatingplate 13. Opposite ends of thesecond wick member 33 connect opposite ends of thefirst wick member 31, respectively, thereby forming thecontinuous wick structure 30. - The
second wick member 33 comprises an elongatedfirst wick portion 331, twosecond wick portions 333, twothird wick portions 335, and twofourth wick portions 337. Thefirst wick portion 331 is adhered to a top surface of theheat absorbing portion 131 of theevaporating plate 13. Thefirst wick portion 331 is thinner than each of thesecond wick portions 333. Thus, in general, the working fluid contained in thefirst wick portion 331 is vaporized faster than the working fluid contained in thesecond wick portion 333. Accordingly, the heat of theheat absorbing portion 131 is transferred by thefirst wick portion 331 quickly. Thesecond wick portions 333 extend upwardly and outwardly from opposite ends of thefirst wick portion 331, respectively, and are symmetrically opposite each other. Thesecond wick portions 333 are adhered to top surfaces of thetransition portions 133 of theevaporating plate 13. Thethird wick portions 335 are horizontal, and extend outwardly from thesecond wick portions 333, respectively. Thethird wick portions 335 are adhered to top surfaces of the extendingportions 134 of theevaporating plate 13. Eachfourth wick portion 337 is adhered to an inner surface of thecorresponding sidewall 135 of theevaporating plate 13, and fills a corner formed by thesidewall 135 and the corresponding extendingportion 134. A cross-section of eachfourth wick portion 337 is substantially triangular. That is, a transverse thickness (horizontal, from left to right, as viewed inFIG. 1 ) of thefourth wick portion 337 progressively decreases from a bottom end of thefourth wick portion 337 central to a top end of thefourth wick portion 337. - Referring also to
FIG. 3 , thefirst wick member 31 is elongated and defines a plurality of throughholes 313 therein. In the illustrated embodiment, the throughholes 313 are square or rectangular throughholes 313, and are arranged in a regular m×n array. Thefirst wick member 31 guides the condensed working fluid back to the opposite ends of thesecond wick member 33 of theevaporating plate 13. A bottom surface of thefirst wick member 31 is spaced from a top surface of thefirst wick portion 331, from top surfaces of thesecond wick portions 333, and from top surfaces of thethird wick portions 335. Because the throughholes 313 are defined in thefirst wick member 31, heat of at least some of the vaporized working fluid is absorbed by thecondensing plate 11 directly. Therefore, unlike in other conventional plate-type heat pipes, there is little or even no retardation associated with a wick structure intervening between the vaporized working fluid and thecondensing plate 11. Thus, the heat dissipation efficiency of the present plate-type heat pipe is improved. In alternative embodiments, thethrough holes 313 can be triangular, circular, oval-shaped, elliptical, etc. - Referring to
FIG. 4 , this shows showing part of a condensing plate arrangement of a plate-type heat pipe in accordance with a second embodiment of the present disclosure. Afirst wick member 31 and a number ofthird wick members 34 are adhered to an inner surface of acondensing plate 11. In the illustrated embodiment, thethird wick members 34 fill top ends of the throughholes 313, respectively. Top end surfaces of thethird wick members 34 and a top surface of thefirst wick member 31 are coplanar with one another. Each of thethird wick members 34 has a same thickness. A ratio of the thickness of eachthird wick member 34 to a thickness of thefirst wick member 31 is in the range from about 1/10 to about ⅘. Because thethird wick members 34 are thinner than thefirst wick member 31, paths of heat transfer of the vaporized working fluid to the condensingplate 11 are generally shorter than those of conventional plate-type heat pipes. Thus, the heat dissipation efficiency of the present plate-type heat pipe is improved. In addition, condensed working fluid contained in thethird wick members 34 flows to thefirst wick member 31 to help drive the working fluid contained in thefirst wick member 31 to quickly flow back to the opposite ends of thesecond wick member 33 mounted on the evaporatingplate 13. Thus, stable and reliable performance of the plate-type heat pipe can be ensured. - Referring to
FIG. 5 , this shows showing part of a condensing plate arrangement of a plate-type heat pipe in accordance with a third embodiment of the present disclosure. Afirst wick member 31 and a number ofthird wick members 35 are adhered to an inner surface of a condensingplate 11. A cross-section of each of thethird wick members 35 is a trapezoid. Eachthird wick member 35 has a smaller end, and a larger end opposite to the smaller end. The smaller ends of thethird wick members 35 are all oriented toward the same direction. The larger ends of thethird wick members 35 are all thinner than thefirst wick member 31. - Referring to
FIG. 6 , this shows showing part of a condensing plate arrangement of a plate-type heat pipe in accordance with a fourth embodiment of the present disclosure. Afirst wick member 31 and a plurality ofthird wick members 36 are adhered to an inner surface of a condensingplate 11. A cross-section of each of thethird wick members 36 is concave. The cross-section may for example be arcuate or arc-shaped. That is, a thickness of eachthird wick member 36 gradually increases from a central portion thereof to each of opposite ends thereof. The opposite ends of thethird wick members 36 are all thinner than thefirst wick member 31. - It is to be understood, however, that even though numerous characteristics and advantages of various embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN200910308310.9 | 2009-10-15 | ||
CN2009103083109A CN102042777B (en) | 2009-10-15 | 2009-10-15 | Flat plate type heat pipe |
Publications (1)
Publication Number | Publication Date |
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US20110088876A1 true US20110088876A1 (en) | 2011-04-21 |
Family
ID=43878405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US12/685,619 Abandoned US20110088876A1 (en) | 2009-10-15 | 2010-01-11 | Plate-type heat pipe |
Country Status (2)
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US (1) | US20110088876A1 (en) |
CN (1) | CN102042777B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120148967A1 (en) * | 2010-12-13 | 2012-06-14 | Thomas Thomas J | Candle wick including slotted wick members |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102564188A (en) * | 2012-01-12 | 2012-07-11 | 昆山德泰新材料科技有限公司 | Half internally-toothed copper tube |
US10458719B2 (en) * | 2015-01-22 | 2019-10-29 | Pimems, Inc. | High performance two-phase cooling apparatus |
CN104634148B (en) * | 2015-03-04 | 2016-08-17 | 广东工业大学 | A kind of nanostructured flat-plate heat pipe |
CN110542327B (en) * | 2018-05-29 | 2021-05-28 | 佳世诠股份有限公司 | Flat plate-like heat exchanger and refrigerating apparatus |
CN110780519B (en) * | 2019-09-29 | 2021-10-19 | 深圳市火乐科技发展有限公司 | Projector with a light source |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6269866B1 (en) * | 1997-02-13 | 2001-08-07 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
US20060124281A1 (en) * | 2003-06-26 | 2006-06-15 | Rosenfeld John H | Heat transfer device and method of making same |
US20060162904A1 (en) * | 2005-01-21 | 2006-07-27 | Bhatti Mohinder S | Liquid cooled thermosiphon for electronic components |
US20060185828A1 (en) * | 2003-07-22 | 2006-08-24 | Chikara Takehara | Thermosyphon device, cooling and heating device and method using the thermosyphone device, and plant cultivating method |
US7422053B2 (en) * | 2002-05-15 | 2008-09-09 | Convergence Technologies (Usa), Llc | Vapor augmented heatsink with multi-wick structure |
-
2009
- 2009-10-15 CN CN2009103083109A patent/CN102042777B/en not_active Expired - Fee Related
-
2010
- 2010-01-11 US US12/685,619 patent/US20110088876A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6269866B1 (en) * | 1997-02-13 | 2001-08-07 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
US7422053B2 (en) * | 2002-05-15 | 2008-09-09 | Convergence Technologies (Usa), Llc | Vapor augmented heatsink with multi-wick structure |
US20060124281A1 (en) * | 2003-06-26 | 2006-06-15 | Rosenfeld John H | Heat transfer device and method of making same |
US20060185828A1 (en) * | 2003-07-22 | 2006-08-24 | Chikara Takehara | Thermosyphon device, cooling and heating device and method using the thermosyphone device, and plant cultivating method |
US20060162904A1 (en) * | 2005-01-21 | 2006-07-27 | Bhatti Mohinder S | Liquid cooled thermosiphon for electronic components |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120148967A1 (en) * | 2010-12-13 | 2012-06-14 | Thomas Thomas J | Candle wick including slotted wick members |
Also Published As
Publication number | Publication date |
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CN102042777B (en) | 2013-06-05 |
CN102042777A (en) | 2011-05-04 |
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Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HOU, CHUEN-SHU;HU, JIANG-JUN;XU, CHAO;REEL/FRAME:023762/0207 Effective date: 20100106 Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HOU, CHUEN-SHU;HU, JIANG-JUN;XU, CHAO;REEL/FRAME:023762/0207 Effective date: 20100106 |
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